국제 컨퍼런스
- International Conference-

2014

      J. Lee, J. Kim, G. Ji, H. Kim, and Y. Eo, "Efficient Eye-Diagram Determination Technique of Non-Linearly-Switching Coupled-Data Links Under Power and Ground Fluctuation Noises," International SoC Design Conf.(ISOCC), Nov. 3-5, 2014, Jeju, Korea.

 

2013

√      J. Lee and Y. Eo, "An Efficient Eye-Diagram Determination Technique for Multi-Coupled Interconnect Lines," Power and Timing Modeling, Optimization and Simulation (PATMOS), Sep. 9-11, 2013, Karlsruhe, Germany.


√      H. Kim, J. Lee, and Y. Eo, "Efficient Performance Evaluation of High-Speed Differential Interconnect Lines with Via Discontinuities," Electrical Performance of Electronic Packaging and Systems (EPEPS), Oct. 27-30, 2013, San Jose, CA.


2012

      H. Kim, S. Ji, and Y. Eo, "A New Frequency-Variant Transmission Line Parameter Determination Technique for Very High-Speed Signal Propagation Characterization," IEEE 16th Workshop on Signal and Power Integrity (SPI), May 13-16, 2012, Sorrento, Italy.


2010

      H. Kim, D. Kim, and Y. Eo, "Experimental Via Characterization for the Signal Integrity Verification of Discontinuous Interconnect Line," International SoC Design Conf.(ISOCC), Nov. 22-23, 2010, Incheon, Korea.

 

     D. Kim, H. Kim, and Y. Eo, "Efficient Eye Diagram Determination of Strongly Coupled Lines for Differential Signals," International SoC Design Conf.(ISOCC), Nov. 22-23, 2010, Incheon, Korea.


      D. Kim and Y. Eo, “Signal Integrity Verification of Coupled Interconnect Lines Using Efficient Eye-Diagram Determination," The IEEE International Symposium on Circuits and Systems (ISCAS), May 30 - June2, 2010, Paris, France.

 

2009

      H. Kim, D. Kim and Y. Eo, “Fast Eye Diagram Determination for the Signal Integrity Verification of Frequency-Variant Transmission Lines," International SoC Design Conf.(ISOCC), Nov. 23-24, 2009, Busan, Korea.

 

      Z.B. Khan, H. Kim and Y. Eo, “Signal Integrity Verification of Coplanar Structures for Shielded On-Chip Interconnect Lines," International SoC Design Conf.(ISOCC), Nov. 23-24, 2009, Busan, Korea.

 

      H. Kim and Y. Eo, "High-Frequency Characterization and Circuit Modeling of Via in Multi-Layered IC Package," Global Symposium on Millimeter Waves (GSMM2009), Apr.20-22, 2009, Sendai, Japan .

 

      Z. B. Khan, H. Kim and Y. Eo, “Design of Customized UWB Antenna for System in Package,” IBCAST, Jan. 11-14, 2009, Islamabad, Pakistan.

 

2008

      D. Kim, T. Kim and Y. Eo, “Efficient and accurate signal transient and crosstalk noise determination of frequency-variant RLC transmission lines,” International Symposium on Antennas, Propagation, and EM Theory(ISAPE), pp. 1275-1278, Nov. 3-6, 2008, Kunming, China.

 

      J. Lee, D. Kim and Y. Eo, “Circuit Modeling of Multi-Layer Ceramic Capacitors Using S-Parameter Measurements," International SoC Design Conf.(ISOCC), pp. 358-361. Nov. 24-25, 2008, Busan, Korea.

 

      T. Kim, Y. Song and Y. Eo, “Discontinuous RC Interconnect Line Analysis for Accurate Timing Determination," International SoC Design Conf.(ISOCC), pp. 154-157. Nov. 24-25, 2008, Busan, Korea.

 

      T. Kim, Y. Song and Y. Eo, “Compact Models for Signal Transient and Crosstalk Noise of Coupled RLC Interconnect Lines with Ramp Inputs," IEEE International Symposium on Electronic Design, Test & Application, pp. 205-209. Jan. 23-25, 2008, Hong Kong.

 

      D. Kim, T. Kim and Y. Eo, “Experimental Characterisations of Coupled Transmission Lines," IEEE International Symposium on Electronic Design, Test & Application, pp. 262-265. Jan. 23-25, 2008, Hong Kong.

 

2007

      D. Kim and Y. Eo, “Characterizations of coupled transmission lines using S-parameter measurements," 14th technical meeting on silicon analog RF technologies, 2007, p3. Nov. 27-29, 2007, Tokyo, Japan.

 

      T. Kim and Y. Eo, “Compact signal integrity models of inductance-effect-prominent VLSI interconnect lines," 14th technical meeting on silicon analog RF technologies, 2007, p1. Nov. 27-29, 2007, Tokyo, Japan.

 

      T. Kim, D. Kim and Y. Eo, “Signal transient and crosstalk model of capacitively and inductively coupled VLSI interconnect lines," International SoC Design Conf.(ISOCC), pp. 273-276. Oct. 15-16, 2007, Seoul, Korea.

 

      D. Kim, J. Lee and Y. Eo, “High-frequency-measurement-based IC package performance evaluation," International SoC Design Conf.(ISOCC), pp. 513-516. Oct. 15-16, 2007, Seoul, Korea.

 

      H. Kim, Y. Kim and Y. Eo, “A novel unified modal decoupling technique for efficient multi-conductor signal integrity verification," International SoC Design Conf.(ISOCC), pp. 163-166, Oct. 15-16, 2007, Seoul, Korea.

 

      Y. Eo, “Traveling-wave-based waveform approximation technique(TWA) for efficient signal integrity verification of strongly coupled VLSI interconnect lines," International SoC Design Conf.(ISOCC), pp. 31-34, Oct. 15-16, 2007, Seoul, Korea.

 

      T. Je and Y. Eo, “Efficient signal integrity verification of multi-coupled transmission lines with asynchronously switching non-linear drivers," International Symposium on Quality Electronic Design (ISQED), pp. 419-424, Mar. 26-28, 2007, San Jose, USA.

 

      H. Kim and Y. Eo, "High-frequency-measurement-based frequency-variant transmission line characterization and circuit modeling for accurate signal integrity verification," International Symposium on Quality Electronic Design (ISQED), pp. 278-283, Mar. 26-28, 2007, San Jose, USA.

 

2006

      S. Shin and Y. Eo, “Non-physical pseudo-wave-based modal decoupling technique of multi-coupled co-planar transmission lines with homogeneous dielectric media,” International Symposium on Quality Electronic Design (ISQED), 2006, pp. 278-283.

 

      T. Je and Y. Eo, “Efficient signal integrity verification method of multi-coupled interconnect nets with asynchronous circuit switching,” International Symposium on Quality Electronic Design (ISQED), 2006, pp. 419-424.

 

2005

      D. Kim, J. Shim, I. KIm, Y. Eo, "Chirp Control of the Amplifier- and Modulator- integrated DFB Laser for the Transmission over 80km at 10Gb/s," 10th Optoelectronics & Communications Conference(OECC' 05), 6F1-4, pp. 314-315, Seoul Korea, July 4-8, 2005.

 

      D. Kim, J. Shim, Y. Keh, M. Park, and Y. Eo, "Transmitter optical sub-assembly (TOSA) for the 10 Gb/s small form-factor pluggable (XFP) optical transceiver Module," The 6 th Korea-Japan Joint Workshop on Microwave and Millimeter-wave Photonics, Jan. 27, 2005, Gyengju, Korea.

 

2004

      S. Hwang, J. Shim, Y. Eo, S. Yang, H. Kang, B. Jun, and D. Lee, and D. Jang, "Design and fabrication of a 10 Gb/s InGaAs/InP avalanche photodiode (APD) based on the non-local model," Indium Phosphide and Related Materials Conf.(IPRM) '04 , May 31, 2004, Kogashima, Japan.

 

      D. Kim, J. Shim, Y. Eo, J. Kang, M. Park, and D. Jang, "The effects of semi-insulating current blocking layers on static and dynamic characteristics in direct modulated semiconductor lasers," Indium Phosphide and Related Materials Conf.(IPRM) '04 , May 31, 2004, Kogashima, Japan.

 

      S. Shin, Y. Eo, W. R. Eisenstadt, and J. Shim, "Analytical dynamic time delay model of strongly coupled RLC interconnect lines dependent on switching," ISQED 2004, 5th International Symposium on Quality Electronic Design, pp. 337-342, USA.

 

2002

      D. Bang, J. Shim, J. Kang, M. Um, S. Park, S. Lee, D. Jang, and Y. Eo, "1.3um uncooled InGaAsP/InP DFB lasers for 10Gb/s ethernet applications," 14th Indium Phosphided and Related Materials Conf., May. 2002.

 

      S . Shin, Y. Eo, W. R. Eisenstadt, and J. Shim, "Analytical signal integrity verification models for inductance-dominant multi-coupled VLSI interconnects," The Fourth International IEEE/ACM Workshop on System Level Interconnect Prediction-SLIP 2002, pp. 61-68, USA.

 

2001

      Y . Eo, J. Kang, J. Shim, and J. Jeong, "A new electromagnetic interference (EMI) noise estimation technique and experimental verification of a PDP system," Asia Display/ International Display Workshop(IDW) '01, 2001, pp. 1330-0433, Japan.

 

      J . Shim, Y. Eo, and D. H. Jang, "SCH doping effects in a 1.55um InGaAsP/InGaAsP MQW electro-absorption modulator," CLEO/PR 2001, Makuhari, Jul. Japan.

 

      J . Shim, Y. Eo, and S. Arai, "Advantages of distributed reflector (DR) LD s integrated with electro -a bsorption modulator," OECC/IOOC 2001, Sydney, Jul. Australia.

 

      W . Jin, Y. Eo, J. Shim, W. R. Eisenstadt, M. Park, and H. Yu, "Silicon substrate coupling noise modeling, analysis, and experimental verification for mixed signal integrated circuit design," International Microwave Symposium Digest, pp. 1727-1730, 2001.

 

      Y . Eo, "Simultaneous switching noise modeling, analysis, and simulation in multi-layer integrated circuit packaging," SEMICON Korea Technical Symposium 2001, Seoul Korea, Feb., pp. 247-256, 2001.

 

2000

      J . Shim and Y. Eo, "Fabrication and analysis of 1.3u m spot-size-converter integrated laser diodes," International Symposium on Optical Communications(ISOC), D-24, Japan, Aug. 2000.

 

~ 1999

      D . Cho, Y. Eo, M. Seung, N. Kim, O. Kwon, and H. Park, "Interconnect capacitance, crosstalk, and signal delay for 0.35um CMOS technology," IEEE International Electron Devices Meeting(IEDM), San Francisco, CA, Dec. 8-11, pp. 619-622, 1996.

 

      W . R. Eisenstadt and Y. Eo, "Determination of IC interconnect line parameters by S-parameter measurements," IEEE Proceedings of VMIC (VLSI Multi-level Interconnect Conference), Jun. 11-12, pp. 356-358, 1991.

 

      Y . Eo and W. R. Eisenstandt, "Determination of IC interconnect line parameters by S-parameter measurements," SRC 1990 , San Jose, 1990.