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- International Journal -

2019

      J. Kim, J. Shin, D. Lee and Y. Eo , " A New High-Frequency Characterization of Coupled Transmission Lines Fabricated on Lossy Organic Substrates, " accepted on IEEE Transactions on Components, Packaging and Manufacturing Technology, Dec. 2019.

 

      D. Lee, J. Kim, and Y. Eo , " New Wafer-Level High-Frequency Characterization of Coupled Transmission Lines, " IEEE Transactions on Microwave Theory and Techniques, Vol. 67, no. 12, pp.4674-4681, Dec. 2019.

 

      G. Ji, J. Kim, and Y. Eo , " Experimental Complex Permittivity Characterization of Mixed Dielectric Materials over a Broadband Frequency, " Journal of the Korean Physical Society, Vol.75, no. 4, pp.309-312, Aug. 2019.

 

      J. Kim and Y. Eo , " IC Package Interconnect Line Characterization Based on Frequency-Varient Transmission Line Modeling and Experimental S-parameters," IEEE Trans. Components,Packaging and Manufacturing Technology vol. 9, no. 6, June 2019.

 

2016

      H. Kim, J. Kim and Y. Eo , " Broadband Thin-Film Transmission-Line Characterization for Accurate High-Frequency Measurements of On-Wafer Components," IEEE Trans. Microwave Theory and Techniques, vol. 64, no. 3, Mar. 2016.

 

2013

      D. Kim, H. Kim and Y. Eo , " Experimental characterizations of thin film transmission line losses," Electronics Letters, vol. 49, no. 17, Aug. 2013. 

 

      D. Kim, H. Kim and Y. Eo , " A novel transmission line characterization based on measurement data reconfirmation ," International Journal of Electronics, Published online: 29, Apr. 2013.

 

2012

      D. Kim, H. Kim and Y. Eo , " Analytical eye-diagram determination for the efficient and accurate signal integrity verification of signal integrity verification of single interconnect lines," IEEE Trans. Comput.-Aided Design Integr. Circuits Syst. , vol. 31, no. 10, pp. 1536-1545, Oct. 2012.

 

2010

      H. Kim and Y. Eo , " Compact CAD models for the signal integrity verification of multi-coupled transmission lines ," IEICE Trans. Fundamentals , vol. E93-A, no. 4, pp. 752-760, April 2010.

 

2009

      D. Kim and Y. Eo , " S-parameter-measurement-based time-domain signal transient and crosstalk noise characterizations of coupled transmission lines ," IEEE Trans. Adv. Packag. , vol. 32, no. 1, pp. 152-163, Feb. 2009.

 

2008

      H. Kim and Y. Eo , " High-frequency-measurement-based circuit modeling and power/ground integrity evaluation of integrated circuit packages ," IEEE Trans. Adv. Packag. , vol. 31, no. 4, pp. 910-918, Nov. 2008.

 

      T. Kim and Y. Eo , " Analytical CAD models for signal transients and crosstalk noise of inductance-effect-prominent multi-coupled RLC interconnect lines ," IEEE Trans. Computer-Aided Design, vol. 27, no. 7, pp.1214-1227, July 2008.  

 

2005

      S. Hwang, J. Shim, and Y. Eo, " Ohmic Contacts of Pd/Zn/M(=Pd or Pt)/Au to p-Type InP," J. of Kor. Phys. Society , vol. 46, no. 4, pp. L751-L755, Apr. 2005.  

 

2004

      Y. Eo, S. Shin, W. R. Eisenstadt, and J. Shim, " A decoupling technique for efficient timing analysis of VLSI interconnects with dynamic circuit switching , " IEEE Trans. Computer-Aided Design , vol. 23, no. 9, pp. 1321-1337, Sep. 2004.  

 

      D. Kim, J. Shim, D. Jang, and Y. Eo, " Fe-doped InP semi-insulating buried heterostructure for high speed and high power operations in directly modulated semiconductor laser , " IEEE Electronics Letters , vol. 40, no. 15, pp. 937-938, July 2004.  

 

      S. Shin, Y. Eo, W. R. Eisenstadt, J. Shim, " Analytical models and algorithms for the efficient signal integrity verification of inductance-effect-prominent multicoupled VLSI circuit interconnects ," IEEE Trans. VLSI Syst. , vol. 12, no. 4, pp. 395-407, Apr. 2004.

 

2003

      Y. Eo, W. R. Eisenstadt, J. Choi, W. Jin, and J. Shim, " A compact multilayer IC package model for efficient simulation, analysis, and design of high-performance VLSI circuits , " IEEE Trans. Adv. Packag. , vol. 26, no. 4, pp. 392-401, Sep. 2003.

 

2002

      Y. Eo, S. Shin, W. R. Eisenstadt, and J. I. Shim, " Generalized traveling-wave-based waveform approximation technique for the efficient signal integrity verification of multicoupled transmission line system ," IEEE Trans. Computer-Aided Design , vol. 21, no. 12, pp. 1489-1497, Dec. 2002.  

 

      D. Bang, J. Shim, J. Kang, M. Um, S. Park, S. Lee, D. Jang, and Y. Eo, " High-temperature and high-speed operation of a 1.3-um uncooled InGaAsP/InP DFB laser , " IEEE Photon. Technol. Lett. , vol. 14, no. 9, pp. 1240-1242, Sep. 2002.  

 

      Y. Yoon, J. Shim, D. Jang, J. Kim, Y. Eo, and F. Rhee, " Transmission spectra of fabry-perot etalon filter for diverged input beams , " IEEE Photon. Technol. Lett. , vol. 14, no. 9, pp 1315-1317, Sep. 2002.  

 

      J. Shim, J. Kim, D. Jang, Y. Eo, and S. Arai, " Facet reflectivity of a spot-size-converter integrated semiconductor optical amplifier , " IEEE J. Quantum Electron. , vol. 38, no. 6, pp. 665-673, Jun. 2002.  

 

      Y. Eo, J. Shim, and W. R. Eisenstadt, " A traveling-wave-based waveform approximation technique for the timing verification of single transmission lines , " IEEE Trans. Computer-Aided Design , vol. 21, no. 6, pp. 723-730, Jun. 2002.

 

2001

      D. Jang, J. Shim, J. Lee, and Y. Eo, " Asymmetric output characteristics in 1.3-um spot-size converted laser diodes , " IEEE J. Quantum Electron. , vol. 37, no. 12, pp. 1611-1617, Dec. 2001.  

 

      W. Jin, Y. Eo, W. R. Eisenstadt, and J. Shim, " Fast and accurate quasi-3-dimensional Capacitance Determination of Multi-Layer VLSI Interconnects , " IEEE Trans. VLSI Syst., vol. 9, no. 3, pp. 450-460, Jun. 2001.

 

2000

      Y. Eo, W. R. Eisenstadt, and J. Shim, " S-parameter measurement-based high-speed signal transient characterization of VLSI interconnects on SiO 2 -Si substrate , " IEEE Trans. Adv. Packag. , vol. 23, no. 3, pp. 470-479, Aug. 2000.  

 

      W. Jin, S. Yoon, Y. Eo, and J. Kim, " Experimental characterization and modeling of transmission line effects for high-speed VLSI circuits interconnects , " IEICE Trans. Electronics , vol. E83-C, no. 5, pp. 728-735, May 2000 . 

 

      Y. Eo, W. R. Eisenstadt, J. Jeong, and O. Kwon, " New simultaneous switching noise analysis and modeling for high-speed and high density CMOS IC package design , " IEEE Trans. Adv. Packag. , vol. 23, no. 2, pp. 303-312, May 2000. 

 

      Y. Eo, W. R. Eisenstadt, J. Jeong, and O. Kwon, " A new on-chip interconnect crosstalk model and experimental verification for CMOS VLSI circuit design , " IEEE Trans. Electron Devices , vol. 47, no. 1, pp. 129-140, Jan. 2000.  

 

~ 1999

      W. Jin, H. Yoo, and Y. Eo, " Non-uniform multi-layer IC interconnect transmission line characterization for fast signal transient simulation of high-speed/high-density VLSI circuits , " IEICE Trans. Electronics , vol. E82-C, no. 6, pp. 955-966, Jun. 1999.  

 

      S. Lee, J. Jeong, J. Hwang, Y. Eo, and O. Kwon, " Utilization of photon emission microscopy in determining drain junction property of submicron NMOSFETs , " J. of Kor. Phcis. Society , vol. 33, pp. S220-S223, Nov. 1998.  

 

      Y. Kim, Y. Park, Y. Eo, O. Kwon, and C. Lee, " Simulator for interconnects and general multiline analysis (SIGMA): simulation algorithm of lossy multiple transmission lines , " J. of Kor. Phys. Society , vol. 33, pp. 129-134, Nov. 1998.  

 

      S. Lee, H. Lee, Y. Lee, J. Jeong, Y. Eo, O. Kwon and C. Lee , " Trade-off between hot carrier effect and current driving capability due to drain contact structures in deep submicron MOSFETs, " Jpn. J. Appl. Phys. , vol. 37 Part 1. no. 3B, pp. 1041-1046, Mar. 1998.  

 

      Y. Eo and W. R. Eisenstadt, " Generalized coupled interconnect transfer function and high-speed signal simulations , " IEEE Trans. Microwave Theory Tech. , vol. 43, no. 5, pp. 1115-1121, May 1995.  

 

      Y. Eo and W. R. Eisenstadt, " Simulations and measurements of picosecond signal transients, propagation, and crosstalk on lossy VLSI interconnect , " IEEE Trans. Comp., Packag., Manufact. Technol. A , vol. 18 no. 1. pp. 215-225, Mar. 1995.  

 

      Y. Eo and W. R. Eisenstadt, " High speed VLSI interconnect modeling based on S-parameter measurements , " IEEE Trans. Comp., Hybrids, Manufact. Technol. , vol. 16, no. 5, pp. 555-562, Aug. 1993.  

 

      W. R. Eisenstadt and Y. Eo, " S-parameter-based IC interconnect transmission line characterization , " IEEE Trans. Comp., Hybrids, Manufact. Technol. , vol. 15, no. 4, pp.483-490, Aug. 1992.